- 品牌：
-
- CUI Devices (2)
- Wakefield-Vette (58)
- Product Status：
-
- Material：
-
- Attachment Method：
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- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
3,704
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
1,636
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK CPU 21MM... |
1 |
2,628
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 21X12MM S... |
1 |
446
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 21X21MM D... |
1 |
200
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 21MM X 21... |
1 |
375
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 21X21X12MM... |
1 |
745
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 21X21X12MM... |
1 |
392
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,066
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 21MM X 21... |
1 |
56
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK CPU 21MM... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 21MM X 21... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
50,000
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 21X21X23MM... |
1 |
258
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 21MM X 21... |
1 |
1,243
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEATSINK 21X23MM D... |
1 |
120
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 21MM X 21... |
1 |
228
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 21MM X 21... |
1 |
74
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 21MM X 21... |
1 |
76
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 21MM X 21... |
1 |
879
In-stock
|
提交询价 |
